
Using modern wafer bonding technologies, single-crystal diamond (SCD) wafers can be produced combining the ultimate thermal substrate (that is, diamond) with any proven semiconductor such as Si, SiC, GaN, etc.
The use of diamond starts as a replacement of the 99% part of a silicon chip / wafer that is passive and today needs to perform much better thermally than active semiconductors can deliver.
The end result is the best of all worlds: proven silicon chips combined with the ultimate thermal semiconductor substrate.
